BRIEF-China Shandong Hi-Speed Financial Announces ‍Issue Of Additional $200 Mln Bonds Due 2019

March 7 (Reuters) – China Shandong Hi-Speed Financial Group Ltd: * ANNOUNCES ‍ISSUE OF ADDITIONAL US$200 MILLION 3.9% GUARANTEED BONDS DUE 2019 Source text for Eikon: Further company coverage: Our Standards:The Thomson Reuters Trust Principles.
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